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We sincerely thank every guest and partner who visited the CKplas booth.
This year, CKplas showcased its latest developments in smart carriers, advanced packaging, and automation integration, while exchanging insights on the future of semiconductor manufacturing.
As AI and advanced packaging continue to evolve, CKplas remains committed to connecting carriers, processes, automation, and intralogistics for greater efficiency and reliability. We believe the carrier of the future is more than a container—it is a key interface for smart manufacturing. Thank you for your valuable exchanges and support. We look forward to shaping the next generation of semiconductor manufacturing together.
Next stop: SEMICON West 2026. We look forward to seeing you again!
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