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● FOUP / FOSB / SMIF Pod
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● Headquarters-Taiwan
Contact:Mrs. Li
TEL : +886-3-318-5300#202
FAX : +886-3-328-2290
E-Mail : sales@ckplas.com


● Locatings-China
Contact:Mrs. Li
TEL:+86-512-83667689/90
FAX:+86-512-83667691
E-Mail : sales@ckplas.com.cn

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| Transparent FOUP 25slot (300mm / 12 inch)

 
Transparent FOUP / PC FOUP
Products Specification
● Product name:Transparent FOUP
● Part number:H300-S1T
● Dimension:440(L) x 347(W) x 337(H)mm
● Weight:5000g
● Capacity:25 PCS
● Apply for round wafer:300mm(12 inch)Wafer
● Material:Customized
● Slot pitch:10 mm
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Products Description

Transparent FOUP / PC FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate.

Transparent FOUP / PC FOUP Features

Transparent FOUP / PC FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, Transparent FOUP / PC FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

Transparent FOUP / PC FOUP
Transparent FOUP / PC FOUP - front

Transparent FOUP / PC FOUP
Transparent FOUP / PC FOUP - back

 

Transparent FOUP / PC FOUP
前開式晶圓傳送盒CK313 前開式晶圓傳送盒CK313 前開式晶圓傳送盒CK300
FOUP CKH313
13 slot
FOUP CKH313
13 slot Back Support
FOUP CKH300
25 slot
Ckplas could customize the product depends on customer’s requirements on different manufacturing process.
Wafer Type Standard Version Wafer Thin Wafer 
Process Type General Process Low Moisture Absorption Material General Process 
Model H300-S1 H300-L1 H313-S1 H313-S2
Capacity 25 slot 25 slot 13 slot 13 slot
Weight     5.6kg 6.2kg
Main Material PC ESD CBM ESD PC ESD PC ESD
Rear Window See Through Window Black Window See Through Window Black Window With Back Support
Temperature Tolerance ≦ 80°C ≦ 80°C
Inflatable Raft Distance 160x250mm 160x250mm 
RUN CARD v v v v
RFID v v v v

Wafer Type Thin Wafer   
Process Type General Process Low Moisture Absorption Material High Temperature Process
Model H313-S3 H313-L1 H313-L2 CK313HT
Capacity 13 slot 13 slot 13 slot 13 slot
Weight 6kg 5kg 6kg 6.6kg
Main Material PC ESD CBM ESD CBM ESD PEI ESD
Rear Window See Through  Window With Back Support Black Window Black Window With Back Support ESD Removable
Airtight Black Window
Temperature Tolerance ≦ 60°C ≦ 80°C ≦ 80°C ≦ 150°C
Inflatable Raft Distance 160x250mm   160x260mm
RUN CARD v v v x
RFID v v v x

 

Product Feature
Heat resistant FOUP & Movable Window Heat resistant FOUP & Movable Window
Heat resistant FOUP & ESD Removable Airtight Black Window
Patent No.:
Taiwanese Patent No.:I586597、M563421、M588109、M628876、M625383、M654854
Chinese Patent No.:CN204348693U、CN205609490U、 CN206259327U、CN208007736U、CN210654281U 、CN210654281U
Korea Patent No.:20-0486265
Customized
Transparent FOUP / PC FOUP, Able to install RFID & Run Card Transparent FOUP / PC FOUP, Black Window With Back Support
● Able to install RFID & Run Card

● Black Window With Back Support

Related Products
FOUP Door key
 
FOUP CK300
 
FOUP CK300
 
Wafer SMIF Pod
FOUP Door key   12" 13 slot FOUP   12" 13 slot FOUP (Back Support)   8" Wafer SMIF Pod
 
 
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