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| ● Product name：8" Wafer Expander Rings |
| ● Part number：EX-R200 |
● Dimension：
Inner ring-
Ø206.11(O.D.) x 194.5(I.D.) x 5.8(H)mm
Outer ring-Ø210.31(O.D.) x 202.35(I.D.) x 5.7(H)mm |
| ● Weight：40g |
| ● Apply for round wafer：6 inch (Ø150mm) |
| ● Material：Resin |
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| Grip Ring can be used in semiconductor and LED chip, consisted of inner and outer ring. Grip Ring able to fix wafer to let it expand, provide variety of specs for customer to choose. |
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| Wafer size：6inch、7inch、8inch |
Hoop Ring Shipper
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Product would be more stable and accurate after test such as surface resistance, pulling and bending. High quality Grip Ring can largely reduce costs by pick up speed of grain picking during manufacturing and then reduce process time and NG products. |
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| Special size of Grip Ring can be customized by customers’ request. |
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